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  bourns part no. inductance q typ. test freq. srf mhz dcr i rms nh tol. % (@ 100 mhz) l mhz min. mohm max. ma max. ce201210-1n5d 1.5 0.3 nh 21 100 4000 100 300 ce201210-1n8d 1.8 0.3 nh 18 100 4000 100 300 ce201210-2n2d 2.2 0.3 nh 18 100 4000 100 300 ce201210-2n7d 2.7 0.3 nh 19 100 4000 100 300 ce201210-3n3j 3.3 5 16 100 4000 130 300 ce201210-3n9j 3.9 5 18 100 4000 150 300 ce201210-4n7j 4.7 5 18 100 3500 200 300 ce201210-5n6j 5.6 5 20 100 3200 230 300 CE201210-6N8J 6.8 5 20 100 2800 250 300 ce201210-8n2j 8.2 5 21 100 2400 280 300 ce201210-10nj 10 5 20 100 2100 300 300 ce201210-12nj 12 5 21 100 1900 350 300 ce201210-15nj 15 5 22 100 1600 400 300 ce201210-18nj 18 5 24 100 1500 450 300 ce201210-22nj 22 5 23 100 1400 500 300 ce201210-27nj 27 5 23 100 1300 550 300 ce201210-33nj 33 5 24 100 1200 600 300 ce201210-39nj 39 5 23 100 1000 650 300 ce201210-47nj 47 5 23 100 900 700 300 ce201210-56nj 56 5 23 100 800 750 300 ce201210-68nj 68 5 25 100 700 800 300 ce201210-82nj 82 5 24 100 600 900 300 ce201210-r10j 100 5 23 100 600 900 300 ce201210-r12j 120 5 22 50 500 950 300 ce201210-r15j 150 5 22 50 500 1000 300 ce201210-r18j 180 5 23 50 400 1100 300 ce201210-r22j 220 5 20 50 350 1200 300 ce201210-r27j 270 5 20 50 300 1300 300 ce201210-r33j 330 5 22 50 250 1400 300 ce201210-r39j 390 5 17 50 250 1300 300 ce201210-r47j 470 5 17 50 200 1500 300 9.0 (.354) 12.0 (.472) 2.0 0.8 (.079 .031) 60.0 (2.362) 178.0 (7.00) dia. 13.5 0.5 (.531 .020) dia. 13.0 0.5 (.512 .020) dia. 21.0 0.8 (.827 .031) packaging specifications ce201210 series - multi-layer chip inductors features 0805 size available in e12 series high frequency nickel barrier lead free applications mobil phones cellular phones ctv, vcr, hic, fdd automotive electronics electrical specifications product dimensions recommended layout 2.0 0.2 (.079 .008) a 0.20 (a 0.008) 0.5 0.3 (0.02 0.008) 1.0 0.2 (.039 0.08) general specifications temperature rise ...................30 ?c max. at rated current operating temperature .-55 ? to +125 ? storage temperature..-55 ? to +125 ? reflow soldering ...230 ?, 50 sec. max. resistance to soldering heat ...............................260 ?c, 10 seconds materials base material .............................ceramic terminal.....................................ag/ni/sn packaging: 0.85 mm product height ................................4,000 pcs. per reel 1.00 mm product height ................................4,000 pcs. per reel 1.25 mm product height ................................2,000 pcs. per reel 1.0 (.039) 1.0 (.039) 3.0 (.118) dimensions: mm (inches) model dimension a c e201210-1n5d through ce201210-82nj ce201210-r10j through ce201210-r39j ce201210-r47j 0.85 (0.033) 1.00 (0.039) 1.25 (0.050) *rohs directive 2002/95/ec jan 27 2003 including annex specifications are subject to change without notice. customers should verify actual device performance in their specific applications. *rohs compliant
specifications are subject to change without notice. customers should verify actual device performance in their specific applications. ce201210 series - multi-layer chip inductors rev. 09/20/05 1 10 100 1000 dc current (ma) frequency (mhz) q characteristics dc bias characteristics 0.1 1 10 100 inductance ( h) q 330 100 4r7 1r2 r12 10 100 1000 10000 1 10 100 1000 10nj 22nj 47nj 82nj 6n8j electrical specifications


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